SK hynix to present HBM joint research at TSMC’s OIP 2024

(SK hynix)

SK hynix will participate in TSMC’s “Open Innovation Platform (OIP) Forum,” where it plans to unveil its cutting-edge AI memory solutions. TSMC is the world’s largest foundry company. The event will take place on September 25th, 2024, at the Santa Clara Convention Center in California.

According to industry sources on Friday, TSMC is set to host the “OIP Ecosystem Forum 2024,” where it will gather partners and clients to discuss the latest advancements in technology and products. TSMC has been building the OIP with IP companies, EDA firms, and design houses since 2008, helping fabless companies optimize their semiconductor designs for TSMC’s manufacturing processes.

For the 2024 edition, TSMC will highlight how AI is transforming chip design and the latest developments in 3-dimensional integrated circuit system design. The forum will also feature over 50 technical presentations and 47 OIP ecosystem partner exhibitions.

As a TSMC partner, SK hynix will present on collaborative research on 2.5D systems in packages to improve High Bandwidth Memory (HBM) quality and reliability. The company will also showcase its latest AI memory products, including HBM3E, LPCAMM2, and GDDR7, at its booth.

Other industry leaders like NVIDIA, Microsoft, AMD, Arm, Cadence, and Synopsys will also deliver technical presentations at the event.

The OIP Forum will take place across six regions, including the United States and Japan in October 2024 followed by Taiwan, China, Europe, and Israel a month later, with over 750 companies and more than 6,000 attendees expected to participate.