Samsung Electro-Mechanics, LG Innotek unveil next-gen chip substrates

Samsung Electro-Mechanics exhibition booth at the ‘KPCA Show 2024,’ held from the 4th to the 6th at Songdo Convensia, Incheon. [Courtesy of Samsung Electro-Mechanics]

Samsung Electro-Mechanics Co. and LG Innotek Co. are showcasing their cutting-edge substrates at the International Electronics Circuits and Packaging Show (KPCA Show 2024) that kicked off on Wednesday.

The two companies are highlighting advanced technologies, including glass substrates and flip-chip ball grid arrays (FC-BGA) designed to be used for artificial intelligence (AI) and servers.

The KPCA Show is taking place in Songdo, Incheon, until Friday.

Samsung Electro-Mechanics is displaying next-generation semiconductor boards with large-area, high-multilayer, and ultra-thin designs.

LG Innotek, for the first time, is introducing glass boards, which use glass materials in the board core to significantly enhance bending resistance and reduce signal loss in large-area boards.

In addition to FC-BGAs, LG Innotek is also unveiling its innovative technologies in package and tape substrates.