IBM's new anti-fraud AI chips to be made on Samsung Foundry's 5nm nodes

IBM said that its new Telum II Processor and Spyre Accelerator fraud prevention chips will be produced on Samsung's 5-nanometer nodes.

Screen capture from IBM's newsroom website [IBM]

IBM’s two new AI chips designed to prevent financial fraud will be produced on Samsung Foundry’s 5-nanometer nodes, the U.S. computing giant said on Monday.

IBM unveiled the Telum II Processor and Spyre Accelerator at Hot Chips 2024, an annual semiconductor conference held at Stanford University.

The Telum II is IBM’s second-generation AI chip that will be deployed in its next-generation IBM Z mainframe systems to prevent financial fraud. The on-chip cache capacity increased by 40 percent compared to its predecessor and includes a data processing unit.

Spyre is IBM’s first proprietary AI accelerator that complements the Telum II by providing additional computational power. It is an add-on option that enterprises can choose to include, tailored for complex AI workloads and inferences, with a maximum memory capacity of 1TB.

It is designed to consume no more than 75 watts per card.

The two chips will be manufactured by Samsung Foundry, as was the case with IBM’s preceding Telum processor.

IBM believes its two new products can mitigate risks in financial crimes such as insurance fraud and money laundering.

"The Telum II Processor and Spyre Accelerator are designed to deliver high-performance, secured and more power-efficient enterprise computing solutions,” said Tina Tarquinio, vice president of IBM’s product management for IBM Z and LinuxONE. “After years in development, these innovations will be introduced in our next generation IBM Z platform so clients can leverage LLMs and generative AI at scale."

BY LEE JAE-LIM [lee.jaelim@joongang.co.kr]