LG Innotek to expand application of digital twin technology

[Courtesy of LG Innotek Co.]

LG Innotek Co., an information technology component unit of South Korea’s LG Group, announced on Thursday that it will work with U.S. engineering simulation company Ansys Inc. to expand the application of its Digital Twin technology.

Digital Twin technology involves creating an exact digital replica of a physical object in a virtual space to simulate and predict real-world scenarios using a computer.

This technology is rapidly gaining attention in the manufacturing industry as it significantly reduces product development time and costs.

Ansys is recognized for its top-tier technology and experience in simulation, using tools such as three-dimensional (3D) modeling, artificial intelligence (AI), and machine learning.

This collaboration will enable LG Innotek to leverage Ansys‘ solutions and simulation software to build a comprehensive Digital Twin environment.

LG Innotek said it has already enhanced operational efficiency by adopting digital twin solutions in its research and development (R&D) processes.

The company has reduced the development time for semiconductor package substrates (PS) by up to 99 percent and cut the time needed to predict the warpage of a single substrate from 11 days to just 3.6 hours by using the 3D modeling solution.

The company has also reduced the ramp-up period, or the time needed to enhance production capacity through initial yield improvement, for the next-generation semiconductor substrate, FC-BGA or flip chip ball grid array, by half by optimizing the conditions of the FC-BGA process equipment.

LG Innotek is also actively using the technology in the production processes of automotive components to enhance productivity.

The company plans to enhance productivity by about 40 percent moving forward.

It also plans to collaborate with Ansys to expand the application of the technology across new growth areas such as vehicle communication modules and light detection and ranging (LiDAR).