Intel unveils ambitious 1.4nm process plan

[Photo by Yonhap]

After formalizing its re-entry into the foundry business, Intel Corp. held its first Direct Connect event Wednesday (local time) to showcase its foundry strategy. The U.S. CPU manufacturer had already surprised the industry by revealing a 1.8-nanometer (nm) process chip wafer prototype during its annual developer event in September 2023 and, in the latest event, announced plans to adopt the 14A process, a 1.4nm-class technology, soon.

Samsung Electronics and TSMC have recently unveiled plans to introduce 1.4nm semiconductor processes around 2027. Intel’s disclosure of its next-generation technology roadmap positions the company to compete directly with these industry leaders.

Intel also highlighted the upcoming commercialization of advanced semiconductor packaging techniques, including 3D packaging. The company completed the construction of Fab 9, a cutting-edge packaging facility in New Mexico, United States, in January 2024 with a $3.5 billion investment.

It also emphasized its commitment to aggressive development by announcing its intention to release a new nanometer process roadmap every two years from 2024 onwards.

During the event, Intel said it has already secured significant customers for the 18A process, with four or more major clients on board, expressing confidence that the company can regain foundry leadership starting in 2025.