SGC eTEC E&C completes advanced chip packaging factory in Vietnam

[Courtesy of SGC eTEC E&C]

South Korea’s SGC eTEC E&C has successfully completed a large-scale advanced semiconductor packaging factory in Vietnam, the company said on Thursday.

Located in the Yen Phong 2C Industrial Park of Bac Ninh Province, Vietnam, the facility covers a land area of about 230,000 square meters, equivalent to a size of 32 international standard soccer fields.

The factory with 1 basement floor and 6 floors above ground boasts extensive semiconductor cleanroom facilities designed to maintain controlled conditions for factors such as temperature, humidity, and pressure while preventing the influx of foreign contaminants.

SGC eTEC E&C signed a contract with Amkor Technology in July last year to build the plant for $300 million.

The construction project stands out for its remarkable speed of completion, taking just 15 months from groundbreaking to completion, which is significantly shorter than the 18-month timeline typically required for projects of similar scale, demonstrating exceptional construction quality and engineering capabilities, SGC eTEC E&C said.

The official inauguration ceremony, which took place on Wednesday, was attended by SGC Group Chairman Lee Bok-young, SGC eTEC E&C President Ahn Chan-kyu, Amkor Technology Executive Vice Chairman Susan Kim, Amkor Technology Korea Co-Rep Dir/Vice President Ji Jong-rib, and Vietnamese Deputy Prime Minister Tran Luu Quang.