Samsung develops industry’s first LPCAMM

[Courtesy of Samsung Electronics]

Samsung Electronics has unveiled the industry’s first Low Power Compression Attached Memory Module (LPCAMM), in a significant breakthrough in the DRAM market for PCs, laptops, and potentially data centers. The new memory module, boasting speeds of 7.5 gigabits per second (Gbps), has successfully completed system verification via Intel’s platform.

Traditionally, PCs and laptops have relied on LPDDR DRAM or DDR-based So-DIMMs for their memory needs. Although LPDDR is compact, its permanent attachment to the motherboard presents challenges when repairs or upgrades are necessary. In contrast, So-DIMMs provide flexibility for attachment and detachment but often come with performance limitations and other physical constraints.

Demand for LPCAMMs is expected to grow rapidly amid a bright outlook for the laptop market. The share of ultra-slim laptops is expected to grow from 64 percent this year to 88 percent in 2027, a compound annual growth rate of about 14 percent.

LPCAMM represents a game-changing solution that solves the limitations of both LPDDR and So-DIMMs. As a detachable memory module, LPCAMM provides enhanced flexibility for manufacturers during the production process. It also occupies up to 60 percent less space on the motherboard compared to So-DIMMs, enabling more efficient usage of the device’s internal space. The benefits extend beyond space efficiency, with LPCAMM delivering up to a 50 percent boost in performance and up to a 70 percent improvement in power efficiency compared to traditional options.

The LPDDR’s power-saving features have made it appealing for servers, potentially enhancing total cost of operation efficiency. However, it had its drawbacks, such as the need to replace the entire motherboard when upgrading server DRAM specifications. LPCAMM is poised to overcome these challenges and position itself as the preferred choice for future data centers and servers.

LPCAMM is set to undergo testing with major customers using next-generation systems within this year, with plans for commercialization scheduled for 2024.

“The energy efficiency and repairability advantages of LPCAMM make this new form factor a game changer in today’s PC market,” according to Intel’s Vice President of Memory & IO Technology Dr. Dimitrios Ziakas.