Solus becomes first Korean supplier of ultra-thin copper foils to SK hynix
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Solus Advanced Materials’ ultra-thin copper foil product recently obtained approval from SK hynix. The ultra-thin copper foil is a critical material enabling semiconductor miniaturization, integration, and high performance, and is particularly suitable for modified semi-additive process (MSAP) manufacturing.
Ultra-thin copper foils refer to copper foils with a thickness as small as 2 micrometers (µm), approximately 1/50th the width of a human hair. The extremely thin nature of these foils presents significant manufacturing challenges, requiring precise and uniform production processes.
Traditionally, the market for ultra-thin copper foils has been dominated by Japanese companies and Solus Advanced Materials said its achievement in becoming the first Korean company to secure product approval from SK hynix is thus meaningful.
The ultra-thin copper foils to be supplied to SK hynix are a result of Solus Advanced Materials’ collaboration with its European integrated subsidiary, Volta Energy Solutions (VES), which boasts state-of-the-art production facilities capable of manufacturing ultra-thin copper foils with a thickness of 1.5 µm or less and holds a global market share of over 60 percent in high-end copper foils.
Solus Advanced Materials not only caters to SK hynix but also supplies ultra-thin copper foil products to various global clients. The company commenced mass production of ultra-thin copper foils for non-memory semiconductor applications starting in May 2023.
It also actively engages in sample testing to meet the diverse requirements of clients from various industrial sectors.
“Securing product approval from SK hynix, a leading memory semiconductor company, as the first Korean company is highly significant. We are committed to providing top-notch products and will demonstrate our technical prowess as we enter full-scale production in 2024,” Solus Advanced Materials CEO Seo Kwang-byeok said.
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