Samsung has 50% of HBM market, refuting competitiveness concerns

2023. 7. 7. 10:00
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Kyung Kye-hyun, chief executive officer and head of device solutions (DS) division at Samsung Electronics Co. [Photo provided by Samsung Electronics]
South Korean tech giant Samsung Electronics Co. refuted concerns over the company’s memory competitiveness, saying that the “market share of Samsung‘s high bandwidth memory (HBM) products is still more than 50 percent.”

Kyung Kye-hyun, chief executive officer and head of device solutions (DS) division that oversees semiconductors said in the company’s internal communication channel We Talk on Wednesday, “Recently, (Samsung’s) HBM3 products have been receiving excellent reviews from customers,” according to multiple sources from the industry on Thursday.

HBM is a high-performance product that revolutionizes data processing speed compared to conventional dynamic random access memory (DRAM) by vertically connecting multiple DRAM. HBM3 is the fourth-generation product, following first-generation HBM, second-generation HBM2 and third-generation HBM2E.

“We expect HBM3 and HBM3P to contribute to the increase in DS division profit next year,” Kyung said. “The market share of double-data rate (DDR) 5 will also surpass the average market share of DRAM at Samsung by the end of this year,” Kyung said. “We will lay the groundwork for Samsung’s DRAM to take another step forward by the end of the year and start executing from next year.”

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