Samsung’s second-generation 3nm chips 22% faster than 4nm chips
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The new 3nm process improves chip performance by more than 20 percent compared with the current 4nm (SF4) process, a level that industry observers say threatens rival Taiwan Semicondujctor Manufacturing Co.
According to industry sources on Monday, the South Korean tech giant revealed its chip technology status in a preliminary presentation material for the 2023 International VLSI Symposium. The symposium, billed as the world’s most prestigious semiconductor conference, will be held next month in Japan.
The presentation material states that chips from the second-generation 3nm process is 22 percent faster and 34 percent more power-efficient than those from the current 4nm process. In addition, the chip size will be reduced by 21 percent compared with the previous generation.
The release of new information is significant because it is the first time Samsung has compared its future chip manufacturing process to its primary 4nm process. Previously, the company used its 5nm process as a benchmark when comparing its performance to next-generation technology. When Samsung first began producing its first-generation 3nm process in June of last year, it claimed that chip performance was 23 percent higher and the chip size was 16 percent smaller compared to those on the 5nm process.
Industry experts cautiously evaluate Samsung’s latest achievement as a significant advancement in its technological capabilities, especially in light of the competition with TSMC. The Taiwanese company recently announced that its second-generation 3nm process improved chip performance by 18 percent and reduced chip power consumption by 32 percent compared to its 5nm (N5) process chips. TSMC’s N5 process is generally considered to be similar to or lower in technology than Samsung’s SF4 process.
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