Samsung Elec releases LPDDR5 multichip package for 5G smartphones

[Photo provided by Samsung Electronics Co.]

The world’s biggest chipmaker Samsung Electronics Co. released a new high-performance multichip package solution for 5G smartphones.

Samsung Electronics said on Tuesday that it has begun mass producing low-power double data rate 5 (LPDDR5) universal flash storage (UFS)-based multichip package (uMCP) that combines the fastest LPDDR5 DRAM and the latest UFS 3.1 NAND flash to deliver the best performance for a broad range of smartphone users.

The new uMCP integrates DRAM and NAND storage into a single compact package which measures only 11.5 millimeters in width and 13mm in length to enhance space and design efficiency for smartphone makers.

It provides a wide choice of capacity and storage options to meet the diverse needs of smartphones with DRAM capacities ranging from 6 gigabytes (GB) to 12 GM and NAND flash from 128GM to 512GM.

The new chip package will also allow low- to mid-tier smartphone users to enjoy high quality services based on 5G that consume a huge amount of data in reliable condition, the company said.

“Samsung’s new LPDDR5 uMCP is built upon our rich legacy of memory advancements and packaging know-how, enabling consumers to enjoy uninterrupted streaming, gaming and mixed reality experiences even in lower-tier devices,” said Sohn Young-soo, vice president of the memory product planning team at Samsung Electronics. “As 5G-compatible devices become more mainstream, we anticipate that our latest multichip package innovation will accelerate the market transition to 5G and beyond, and help to bring the metaverse into our everyday lives a lot faster.”

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