AI chip boom fuels heat management technology development

Glass substrates produced by SKC’s semiconductor glass substrate subsidiary Absolics. (SKC)

With the rapid growth of high-performance artificial intelligence (AI) semiconductors, chipmakers are intensifying efforts to develop heat management technologies.

According to industry sources, South Korean chipmakers are accelerating the development of next-generation technologies aimed at improving power efficiency and addressing heat challenges in AI semiconductors. High-performance AI chips consume large amounts of power for fast processing speeds and complex tasks, generating significant heat and making thermal control a critical challenge.

Among emerging solutions, glass substrates are gaining attention as a potential breakthrough in semiconductor heat management. Offering better heat resistance and reduced warping compared to conventional plastic substrates, glass is ideal for high-density AI semiconductor packaging. However, challenges remain in commercialization due to low yields and fragility.

Several Korean companies are working to bring glass substrates to market. Samsung Electro-Mechanics Co. revealed its roadmap to mass-produce glass substrates by 2027 at Consumer Electronics Show (CES) 2025 in January, with plans for client sample testing. Given its history of supplying high-value substrates to major tech firms, Samsung Electro-Mechanics is expected to commercialize the technology ahead of competitors.

SKC Ltd. is also advancing its glass substrate production. The company is operating the world’s first glass substrate mass production plant in Covington, Georgia, via its subsidiary Absolics Inc., and plans to leverage three years of accumulated expertise to gain a competitive edge.

LG Innotek Co. is investing in facilities and plans to begin pilot production of glass substrates by the end of 2025.

Several domestic suppliers, including Chemtronics Co. (chemical processing), Philoptics Co. (drilling), Joongwoo M-Tech Co. (drilling), and Avaco Co. (equipment), are working closely with Samsung, SK, and LG to support commercialization and mass production.

Immersion cooling is another key heat management technology. This process involves submerging electronic components in cooling fluid to absorb and dissipate heat or directly contacting components with liquid to regulate temperature. The technology gained momentum after Nvidia Corp. incorporated immersion cooling in its next-generation AI accelerator, Blackwell.

SK enmove Co. demonstrated an AI server cooling system using immersion cooling fluid at CES 2025, while other Korean refiners, including GS Caltex Corp., S-Oil Corp., and HD Hyundai Oilbank Co., also showcased their immersion cooling solutions.

Silicon photonics technology is also gaining traction as a heat management solution. By using optical signals instead of electrical signals to process data, silicon photonics reduces heat generation in semiconductor devices.

Taiwan Semiconductor Manufacturing Co. recently announced it is researching silicon photonics. Samsung Electronics unveiled its silicon photonics development roadmap at the Samsung Foundry Forum 2024, while Intel Corp. is also advancing research in the field.